|
ENCAPSULATION:
Neu Dynamics is a leading supplier of encapsulation molds for the semiconductor industry. Conventional molding capabilities include tooling for SOIC, TQFP, SSOP and LED packages. We can integrate the latest "multi-plunger" tooling into existing automatic or manual molding presses.
OPTO-ELECTRONIC/FIBEROPTIC
Mold tooling for the needs of the semiconductor, medical, automotive and electronics industries. Production and development tooling capabilities for both thermoset and thermoplastic materials can be supplied. High cavitation molds for the growing demand for capacitor type devices NDC's designers incorporate features to minimize mold base footprint, to allow for maximum mold flow and increased cavitation for optimum yeilds per cycle.
TRIM & FORM:
The Neu Dynamics trim press line is designed to meet the post mold trim/form requirements of the electronics and semiconductor industries, and is available from one ton bench top thru 12 ton four post. Key features include:
- Unrestricted access to the die area from all sides
- Automatic load/off load
- Enclosed electrical and hydraulic circuitry
- Basic PLC control
- Full safety guarding
- Light screen
BGA/FLIPCHIP/CHIPSCALE:
Our patented molding system for ball grid array assemblies offers universal capabilities for virtually all BGA and MAPs. The Neu Dynamics system allows for changes in package size from cycle to cycle with minimal down time. Development in flipchip and chipscale type devices along with under fill needs are also part of our ongoing efforts in this latest encapsulation technology.
|
